To fulfill the increasing demands of data storage and data processing within modern data centers, a corresponding increase in server performance is necessary. This leads to a subsequent increase in power consumption and heat generation in the servers due to high performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling of high-power density packaging. Therefore, industries utilizing data centers are looking to singlephase immersion cooling using various dielectric fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with TPMS lattice structures were designed for application in singlephase immersion cooling of data center servers. These designs are made possible by Electrochemical Additive Manufacturing (ECAM) technology due to their complex topologies. The ECAM process allows for generation of complex heat sink geometries never before possible using traditional manufacturing processes. Geometric complexities including amorphous and porous structures with high surface area to volume ratio enable ECAM heat sinks to have superior heat transfer properties. Our objective is to compare various heat sink geometries by minimizing chip junction temperature in a single-phase immersion cooling setup for natural convection flow regimes. Computational fluid dynamics in ANSYS Fluent is utilized to compare the ECAM heat sink designs. The additively manufactured heat sink designs are evaluated by comparing their thermal performance under natural convection conditions. This study presents a novel approach to heat sink design and bolsters the capability of ECAM-produced heat sinks.

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