Advanced drive assist systems and support power systems reside underhood where operating temperatures are much higher than in traditional consumer applications. Temperatures in automotive underhood electronics may range from −40 °C to +150°C for long periods of time during operation. Much of the advanced functionality is enable through the use of advanced architectures including flip-chip ball-grid arrays. Underfills are used to enhance the solder joint reliability between the chip and the substrate. However, there is insufficient information about the viscoelasticity of Underfills stored in sustained high temperature for long period of time. In this paper, two different types of Underfills have been cured and aged under two different temperatures: 100 °C and 150 °C. Multi-frequency scan dynamic mechanical analyzer (DMA) test has been conducted to study the viscoelasticity evolution from pristine, 30 days, 60 days, 90 days and 120 days. The master curve has been obtained and the pony pairs of UFs have been calculated. The linear viscoelastic behavior of two kinds of Underfills as the function of aging time and aging temperature has been investigated. Elastic modulus, loss modulus and glass transition temperature are extracted from the results of dynamic loading tests. The aging effect of linear viscoelasticity has been discussed.

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