Electronic parts may be subjected to continuous activity at high temperatures as well as high strain-rate loads in the oil exploration industry, military, automotive, avionics, and space applications, and parts may be stored in non-climate-controlled enclosures prior to deployment. Material properties evolve at even moderate temperatures after a long period of storage, according to previous studies on undoped SAC alloys. To reduce the aging effects, a number of alloy formulations have been proposed. Data on the mechanical properties of lead-free solder alloys used for interconnection in electronic packaging at high strain rates and high storage temperatures is very important for design optimization of electronic package sustainability at extreme temperatures, since SAC soldiers have shown degradation of mechanical properties after prolonged exposure to storage temperature. The use of dopants in SAC solder has been proposed as a solution to minimize degradation. In this study, After keeping the samples in storage at 50°C for 1–8 months, a doped SAC solder called SAC-R (Ecolloy) was subjected to high strain rate testing. Uniaxial impact hammer tensile tests were conducted on samples with no aging and samples that had been aged for up to 8 months to assess the mechanical properties of SAC-R at high and low operating temperatures ranging from −65°C to 200°C and the Mechanical properties has been compared with an undoped solder SAC 105. The constants for the Anand Visco-Plasticity model were calculated using the material data for SAC-R. By comparing model predictions of the uniaxial tensile test with experimental results, the model’s ability to reflect material constitutive behavior has been quantified.