Filters are used in a variety of signal processing applications in commercial and defense electronics. The use of additively printed electronics in high-frequency applications requires an understanding of the process-performance interactions versus frequency of operation. Assembly of filters for integration into existing circuits requires additively printed metallization traces in addition to component attachment methods. Comparison of frequency response of the additively-printed filtering circuits vs conventional filters subtractively-fabricated on rigid substrates is needed to determine the performance parity of additive fabrication methods. In this paper, a micro-dispensing device is used to print conductive traces and electrically conductive adhesive (ECA) pads for the attachment of components. The effect of different print parameters on the width and height of the trace has been studied. Mechanical and electrical properties also play an important role in the study of different sintering conditions. Optimized parameters from the printing process and sintering analysis are used to print and compare commercially available LC filter circuitry using the Bode plot.

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