With more development in electronics system capable of having larger functional densities, power density is increasing. Immersion cooling demonstrates the highest power usage efficiency (PUE) among all cooling techniques for data centers and there is still interest in optimizing immersion cooling to use it to its full potential. The aim of this paper is to present the effect of inclination and thermal shadowing on two-phase immersion cooling using FC-72. For simulation of boiling, the RPI (Rensselaer Polytechnic Institute) wall boiling model has been used. Also, two empirical models were used for calculation of bubble departure diameter and nucleate site density. The boundary condition was assumed to be constant heat flux and the bath temperature was kept at boiling temperature of FC-72 and the container pressure is assumed to be atmospheric. this study showed that due to the thermal shadowing, boiling boundary layer can lay over the top chipset and increases vapor volume fraction over top chipsets. This ultimately causes increase in maximum temperature of second chip. The other main observation is with higher inclination angle of chip, maximum temperature on the chip decreases up to 3°C.