Abstract

Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various use conditions. In this paper, a test protocol has been developed for twisting and flexing on aerosol-jet additively printed flexible circuits. Test patterns with commonly used traces geometries have been developed, aerosol-jet printed, and thermally sintered at various conditions. Reliability data has been acquired under both twist and flex using resistance monitoring. Failure mechanisms have been studied for both deformation modes.

Volume Subject Area:
Flexible and Wearable Electronics
Keywords:
polyimide substrate, additive printing, resistance, aerosol jet printing, failure, reliability, flexing, twisting
Topics:
Aerosols, Bending (Stress), Flexible electronics, Reliability
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Copyright © 2019 by ASME. This work was authored in part by a U.S. Government employee in the scope of his/her employment. ASME disclaims all interest in the U.S. Government’s contribution.
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