For design of automotive airbag electronic control units (AB ECU), it is essential to have a validated and reliable finite element (FE) simulation model in place in order to allow already in an early design stage for the accurate prediction of the ECU’s structural vibration behavior. A “bottom-up” approach which described in the ASME guide for verification and validation (ASME V&V 10-2006) is applied for the validation of the AB ECU simulation model. The AB ECU is decomposed into different assembly level. Single printed circuit board (PCB) is the lowest elementary component level. In the PCB level simulation and validation, the influence of in-plane pre-stress on PCB’s transverse vibration characteristic has been encountered, but it has been found out that the source of the in-plane pre-stress can not be explained by classical beam/plate theory. Analysis and simulation for PCB fixation reveals that the fundamental source of the in-plane pre-stress is structure’s geometric nonlinearity.
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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration
Guo Xiaochuan
Guo Xiaochuan
Bosch Automotive Products (Suzhou) Co., Ltd., Suzhou, China
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Guo Xiaochuan
Bosch Automotive Products (Suzhou) Co., Ltd., Suzhou, China
Paper No:
IPACK2018-8214, V001T05A001; 7 pages
Published Online:
November 13, 2018
Citation
Xiaochuan, G. "In-Plane Pre-Stress Analysis for Automotive Airbag Electronic Control Unit’s Printed Circuit Board Transverse Vibration." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T05A001. ASME. https://doi.org/10.1115/IPACK2018-8214
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