As power densities in advanced electronics continue to rise, the need for high performance thermal solutions becomes increasingly important. Liquid jet impingement has been applied to cooling high power-density electronics due to its ability to dissipate large heat fluxes while maintaining an acceptable operating temperature in the device. Recently, microjets have been embedded within the device substrate, forming a compact solution that is highly scalable. Many practical questions remain, however, on whether microjet technology is ready for actual implementation. In this work, we address several important questions that impede adoption of the technology. Numerical analysis and experimental data are provided to demonstrate the tradeoff between thermal performance and driving pressure requirements through pumping analysis. Additional mechanical concerns regarding robustness to clogging and resistance to erosion are addressed through a 1000-hour extended lifetime test.
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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
Practical Concerns for Adoption of Microjet Cooling Available to Purchase
Stephen M. Walsh,
Stephen M. Walsh
MIT Lincoln Laboratory, Lexington, MA
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James P. Smith,
James P. Smith
MIT Lincoln Laboratory, Lexington, MA
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Eric A. Browne,
Eric A. Browne
MIT Lincoln Laboratory, Lexington, MA
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Timothy W. Hennighausen,
Timothy W. Hennighausen
MIT Lincoln Laboratory, Lexington, MA
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Bernard A. Malouin
Bernard A. Malouin
MIT Lincoln Laboratory, Lexington, MA
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Stephen M. Walsh
MIT Lincoln Laboratory, Lexington, MA
James P. Smith
MIT Lincoln Laboratory, Lexington, MA
Eric A. Browne
MIT Lincoln Laboratory, Lexington, MA
Timothy W. Hennighausen
MIT Lincoln Laboratory, Lexington, MA
Bernard A. Malouin
MIT Lincoln Laboratory, Lexington, MA
Paper No:
IPACK2018-8468, V001T04A026; 8 pages
Published Online:
November 13, 2018
Citation
Walsh, SM, Smith, JP, Browne, EA, Hennighausen, TW, & Malouin, BA. "Practical Concerns for Adoption of Microjet Cooling." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T04A026. ASME. https://doi.org/10.1115/IPACK2018-8468
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