For improving the functionality and signal speed of electronic devices, electronic components have been miniaturized and an increasing number of elements have been packaged in the device. As a result there has been a steady rise in the amount of heat necessitated to be dissipated from the electronic device. Recently microchannel heat sinks have been emerged as a kind of high performance cooling scheme to meet the heat dissipation requirement of electronics packaging, In the present study an experimental study of subcooled flow boiling in a high-aspect-ratio, one-sided heating rectangular microchannel with gap depth of 0.52 mm and width of 5 mm was conducted with deionized water as the working fluid. In the experimental operations, the mass flux was varied from 200 to 400 kg/m2s and imposed heat flux from 3 to 20 W/cm2 while the fluid inlet temperature was regulated constantly at 90 °C. The boiling curves, flow pattern and onset of nucleate boiling of subcooled flow boiling were investigated through instrumental measurements and a high speed camera. It was found that the slope of the boiling curves increased sharply once the superheat needed to initiate the onset of nucleate boiling was attained, and the slope was greater for lower mass fluxes, with lower superheat required for boiling incipience. As for the visualization images, for relatively lower mass fluxes the bubbles generated were larger and not easy to depart from the vertical upward placed narrow microchannel wall, giving elongated bubbly flow and reverse backflow. The thin film evaporation mechanism dominated the entire test section due to the elongated bubbles and transient local dryout as well as rewetting occurred. Meanwhile the initiative superheat and heat flux of onset of nucleate boiling were compared with existing correlations in the literature with good agreement.
- Electronic and Photonic Packaging Division
Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Zhou, K, Li, J, Feng, Z, Li, W, Zhu, H, & Sheng, K. "Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T04A021. ASME. https://doi.org/10.1115/IPACK2018-8447
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