The increasing thermal demands in power electronic systems require the application of high temperature die attach materials. Transient Liquid Phase Sintered (TLPS) paste-based solder alloys have been demonstrated to effectively manage the thermal and mechanical load requirements of power modules. The microstructural features of these alloys provide interconnects with the necessary strength required to sustain high loads at high temperatures. To properly understand the influence of microstructure on mechanical behavior of these alloys, single lap shear experiments were performed on a TLPS system consisting of Copper and Tin particles (Cu-Sn). Nano-indentation measurements were performed on intermetallic phases of the TLPS, and the results obtained from lap shear testing and nano-indentation measurements are presented.
- Electronic and Photonic Packaging Division
Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn
Gutierrez, E, Manoharan, S, Serebreni, M, & McCluskey, P. "Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T04A018. ASME. https://doi.org/10.1115/IPACK2018-8392
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