Powering small electronics like mobile devices off-grid has remained a challenge; hence, there exists a need for an alternate source of powering these devices. This paper examines the efficacy of a novel nanoparticle-immobilized polyethylene wick in maintaining sufficient thermal gradient across a thermoelectric generator to power these devices with energy from waste heat. The work examines several other heat exchangers including heat pipes and loop heat pipe setups. The experimental evidence reveals that the nanoparticle-immobilized polyethylene wick is capable of generating sufficient thermal potential resulting in 5V, which is the minimum voltage required to power small mobile devices. In the opinion of the authors, this is the first ever recorded account of utilizing waste heat to generate enough voltage to power a mobile device. Experiment demonstrated that the nanoparticle-immobilized polyethylene wick showed over 40% thermoelectric voltage generation increment over a plain polyethylene wick and a metal wick in a loop heat pipe setup.
Skip Nav Destination
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink Available to Purchase
Michael Ozeh,
Michael Ozeh
Purdue University Northwest, Hammond, IN
Search for other works by this author on:
A. G. Agwu Nnanna
A. G. Agwu Nnanna
Purdue University Northwest, Hammond, IN
Search for other works by this author on:
Michael Ozeh
Purdue University Northwest, Hammond, IN
A. G. Agwu Nnanna
Purdue University Northwest, Hammond, IN
Paper No:
IPACK2018-8354, V001T04A013; 8 pages
Published Online:
November 13, 2018
Citation
Ozeh, M, & Nnanna, AGA. "Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T04A013. ASME. https://doi.org/10.1115/IPACK2018-8354
Download citation file:
27
Views
Related Proceedings Papers
Related Articles
Observations on an Evaporative, Elbow Thermosyphon
J. Heat Transfer (May,1993)
Development of a 125 kW AMB Expander/Generator for Waste Heat Recovery
J. Eng. Gas Turbines Power (July,2011)
Performance Analysis of a New Cascade Waste Heat Recovery System With a Wider Range of Applications
J. Thermal Sci. Eng. Appl (August,2024)
Related Chapters
Threshold Functions
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
Experimental Study on Heat Pipe Heat Exchanger for Heat Recovery in Room Ventilation
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
Introduction
Thermal Management of Microelectronic Equipment