Thermal Interface materials are crucial elements for packaging of power electronics. In particular, development of high temperature lead free die-attach thermal interface materials for silicon carbide wide bandgap power electronics is a challenge. Failures of power electronics package modules often occur at die-attach areas. Among major options, sintered silver shows advantages in ease of applications. Cost, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and improvement of sintered silver using enhancement structures at micro and nano scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be discussed in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated module systems.
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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
Thermal Interface Materials Enhanced by Micro and Nanostructures
Mei-Chien Lu
Mei-Chien Lu
Monte Rosa Technology, San Francisco Bay Area, CA
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Mei-Chien Lu
Monte Rosa Technology, San Francisco Bay Area, CA
Paper No:
IPACK2018-8307, V001T04A009; 10 pages
Published Online:
November 13, 2018
Citation
Lu, M. "Thermal Interface Materials Enhanced by Micro and Nanostructures." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T04A009. ASME. https://doi.org/10.1115/IPACK2018-8307
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