This work experimentally studies the impact of facility cooling failure of a direct liquid cooling (DLC) system on the IT equipment (ITE). The facility side of a DLC system removes the heat from a secondary loop — in direct contact with the ITE — and discard it in a chiller loop or ambient. The CPU utilization and coolant set point temperature (SPT) are varied to understand the effect of failure under different operating conditions. The ITE response is studied in terms of chip temperature and power, and fan speed. It was found that failure of the facility cooling system is not hazardous to the IT operation. The rate of change in temperature after failure is low and is sufficient to turn the ITE off safely. This is attributed to the surrounding air in the data center and the thermal mass of the cooling system.
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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers
Sami Alkharabsheh,
Sami Alkharabsheh
Binghamton University, Binghamton, NY
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Udaya L. N. Puvvadi,
Udaya L. N. Puvvadi
Binghamton University, Binghamton, NY
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Bharath Ramakrishnan,
Bharath Ramakrishnan
Binghamton University, Binghamton, NY
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Kanad Ghose,
Kanad Ghose
Binghamton University, Binghamton, NY
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Bahgat Sammakia
Bahgat Sammakia
Binghamton University, Binghamton, NY
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Sami Alkharabsheh
Binghamton University, Binghamton, NY
Udaya L. N. Puvvadi
Binghamton University, Binghamton, NY
Bharath Ramakrishnan
Binghamton University, Binghamton, NY
Kanad Ghose
Binghamton University, Binghamton, NY
Bahgat Sammakia
Binghamton University, Binghamton, NY
Paper No:
IPACK2018-8443, V001T02A012; 6 pages
Published Online:
November 13, 2018
Citation
Alkharabsheh, S, Puvvadi, ULN, Ramakrishnan, B, Ghose, K, & Sammakia, B. "Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T02A012. ASME. https://doi.org/10.1115/IPACK2018-8443
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