Fully immersion of servers in electrically nonconductive (dielectric) fluid has recently become a promising technique for minimizing cooling energy consumption in data centers. The improved thermal properties of these dielectric fluids facilitate considerable savings in both upfront and operating cost over traditional air-cooling. This technology provides an opportunity for accommodating increased power densities. It also minimizes the common operational issues of air cooling technique like overheating and temperature swing in the system, fan failures, dust, air quality, and corrosion. This paper presents various data about the thermal performance of a fully single-phase dielectric fluid immersed server over wide temperature ranges (environment temperatures) from 25°C to 55°C for prolonged periods in an environmental chamber. This work explores the effects of high temperatures on the performance of a server and other components like pump, along with potential issues associated with extreme climatic conditions. The experimental data serves as a means to determine failure criteria for the server and pump by subjecting the system to accelerated thermal aging conditions i.e. around 55°C, consequently simulating the most extreme environmental condition that the server may encounter. Connector seals are inspected for expected degradation upon temperature cycling typically at such extreme conditions. Throttling limit for the server and pump power draw for different temperatures was determined to assess pump performance. Determining the relations between component behavior and operating temperature provides an accurate measure of lifetime of a server. The scope of this paper can be expanded by reviewing the effects of low temperatures on server and component performance. Changes to various performance parameters like power draw of pump and server at the higher and the lower operating temperatures and an understanding of issues like condensation can be used to quantify upper and lower limits for pump and server performance.
Skip Nav Destination
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time Available to Purchase
Pratik V. Bansode,
Pratik V. Bansode
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Jimil M. Shah,
Jimil M. Shah
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Gautam Gupta,
Gautam Gupta
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Dereje Agonafer,
Dereje Agonafer
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Harsh Patel,
Harsh Patel
LiquidCool Solutions, Rochester, MN
Search for other works by this author on:
Rick Tufty
Rick Tufty
LiquidCool Solutions, Rochester, MN
Search for other works by this author on:
Pratik V. Bansode
University of Texas at Arlington, Arlington, TX
Jimil M. Shah
University of Texas at Arlington, Arlington, TX
Gautam Gupta
University of Texas at Arlington, Arlington, TX
Dereje Agonafer
University of Texas at Arlington, Arlington, TX
Harsh Patel
LiquidCool Solutions, Rochester, MN
David Roe
LiquidCool Solutions, Rochester, MN
Rick Tufty
LiquidCool Solutions, Rochester, MN
Paper No:
IPACK2018-8432, V001T02A010; 6 pages
Published Online:
November 13, 2018
Citation
Bansode, PV, Shah, JM, Gupta, G, Agonafer, D, Patel, H, Roe, D, & Tufty, R. "Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T02A010. ASME. https://doi.org/10.1115/IPACK2018-8432
Download citation file:
83
Views
Related Proceedings Papers
Related Articles
The Low-Temperature Adsorption Characteristics of Activated Carbon With 3 He and 4 He as Sorption Cooler Cryogens
J. Thermal Sci. Eng. Appl (October,2021)
Novel Combined Power and Cooling Thermodynamic Cycle for Low Temperature Heat Sources, Part II: Experimental Investigation
J. Sol. Energy Eng (May,2003)
Analyses of Radially Rotating High-Temperature Heat Pipes for Turbomachinery Applications
J. Eng. Gas Turbines Power (April,1999)
Related Chapters
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
Case Study 10: Data Reconciliation
Engineering Optimization: Applications, Methods, and Analysis
Comparison of the Availability of Trip Systems for Reactors with Exothermal Reactions (PSAM-0361)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)