Direct evaporative cooling (DEC) is widely used in the data center cooling units to maintain the air condition inside the data centers. Often, the flow rate of the water over the wet cooling media in this DEC process is frequently varied to maintain the air condition inside the data centers based on changing weather conditions. Though the adopted method helps to control the air temperature and relative humidity, the scale formation occurs on the surface of wet cooling media due to the frequent variation of the flow rate and deposition of minerals present in the water at low flow rate values, which increases the total weight of the wet cooling media and it can lead to a wet cooling media collapse. In this paper an alternative and simplified method to control the air condition is presented. A vertically split wet cooling media is designed and tested in a commercial CFD tool to analyze the temperature and relative humidity parameters of the inlet and outlet air to the wet cooling media, in this approach the sections of the media can either be completely wet or completely dry which can potentially avoid the scale formation on the surface of the wet cooling media. In addition to the temperature and relative humidity parameters against the air flow rates, the pressure drop and cooling efficiency values for varied air flow rates are studied. The vertically split wet cooling media configurations are achieved by sectioning the media in to equal and unequal sections. In the equal configuration, media has been tested for 0%, 50% and 100% wetting conditions, and in the unequal configuration, media has been tested for 0%, 33%, 66% and 100% wetting conditions. The test results are used to emphasis the advantage of this staged wetting method and gives a possible solution to the scale formation problem on the wet cooling media during the direct evaporative cooling process in the data center.
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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
August 27–30, 2018
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5192-0
PROCEEDINGS PAPER
A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers
Mullaivendhan Varadharasan,
Mullaivendhan Varadharasan
University of Texas at Arlington, Arlington, TX
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Dereje Agonafer,
Dereje Agonafer
University of Texas at Arlington, Arlington, TX
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Ahmed Al Khazraji,
Ahmed Al Khazraji
University of Texas at Arlington, Arlington, TX
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Jimil Shah,
Jimil Shah
University of Texas at Arlington, Arlington, TX
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Ashwin Siddarth,
Ashwin Siddarth
University of Texas at Arlington, Arlington, TX
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James Hoverson,
James Hoverson
Mestex, a Division of Mestek, Inc., Dallas, TX
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Mike Kaler
Mike Kaler
Mestex, a Division of Mestek, Inc., Dallas, TX
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Mullaivendhan Varadharasan
University of Texas at Arlington, Arlington, TX
Dereje Agonafer
University of Texas at Arlington, Arlington, TX
Ahmed Al Khazraji
University of Texas at Arlington, Arlington, TX
Jimil Shah
University of Texas at Arlington, Arlington, TX
Ashwin Siddarth
University of Texas at Arlington, Arlington, TX
James Hoverson
Mestex, a Division of Mestek, Inc., Dallas, TX
Mike Kaler
Mestex, a Division of Mestek, Inc., Dallas, TX
Paper No:
IPACK2018-8378, V001T02A008; 6 pages
Published Online:
November 13, 2018
Citation
Varadharasan, M, Agonafer, D, Al Khazraji, A, Shah, J, Siddarth, A, Hoverson, J, & Kaler, M. "A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers." Proceedings of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 27–30, 2018. V001T02A008. ASME. https://doi.org/10.1115/IPACK2018-8378
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