A series of experiments was conducted to investigate the performance characteristics of a heat pipe with a hybrid wick that combined grooves and a wire screen. The heat pipe in this study was designed primarily for the cooling of high-density power electronic elements such as IGBTs, and it had tiny triangular grooves along its entire length. The container was a copper tube which had an outer diameter of 19 mm and length of 0.8 m, and the working fluid was water. To lower the thermal resistance against increased thermal loads, a higher performance was desired for the heat pipe, without changing the external dimensions. A fine mesh wire screen was partially applied to the evaporator to enhance the heat transfer performance. The hybrid wick heat pipe was tested and analyzed from the viewpoints of thermal resistance, effective thermal conductance, and operating temperature. For a 1.6 kW effective thermal load, as a typical result, the heat pipe with the hybrid wick exhibited a 70 % decrease in thermal resistance compared to that with a groove wick only. The paper includes results for various thermal loads and fluid charges. The results herein can be utilized in applications that require an intensive enhancement in heat pipe performance.
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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
PROCEEDINGS PAPER
The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
Joon Hong Boo,
Joon Hong Boo
Korea Aerospace University, Goyang, Korea
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Chang Woo Han
Chang Woo Han
Hyosung Corporation, Angyang, Korea
Search for other works by this author on:
Joon Hong Boo
Korea Aerospace University, Goyang, Korea
Hyun Gon Kim
Apack, Inc., Daejeon, Korea
Chang Woo Han
Hyosung Corporation, Angyang, Korea
Paper No:
IPACK2017-74095, V001T04A010; 6 pages
Published Online:
October 27, 2017
Citation
Boo, JH, Kim, HG, & Han, CW. "The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick." Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 29–September 1, 2017. V001T04A010. ASME. https://doi.org/10.1115/IPACK2017-74095
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