Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

The miniaturization of Control Units (CUs), consequently increasing power and reduced component size justifies a growing need for significantly improved Thermal Interface Material (TIM) which is a pivotal material for transferring heat from a die to a heat-spreader. However, it also has a crucial effect on the thermomechanical and dynamic behavior of the attached components. In this paper, the effect of frequency dependency of TIM on dynamic behavior of the attached capacitor is investigated analytically, numerically and experimentally. The results show that it is crucial to consider the frequency dependent material properties of TIM, for reliability assessment of the attached components under dynamic loading conditions.