In this paper, the impact of direct liquid cooling (DLC) system failure on the IT equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the CPU utilization, coolant set point temperature (SPT) and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization and total server power. It was found that failure of the cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.
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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
PROCEEDINGS PAPER
Failure Analysis of Direct Liquid Cooling System in Data Centers
Sami Alkharabsheh,
Sami Alkharabsheh
Binghamton University, Binghamton, NY
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Bharath Ramakrishnan,
Bharath Ramakrishnan
Binghamton University, Binghamton, NY
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Bahgat Sammakia
Bahgat Sammakia
Binghamton University, Binghamton, NY
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Sami Alkharabsheh
Binghamton University, Binghamton, NY
Bharath Ramakrishnan
Binghamton University, Binghamton, NY
Bahgat Sammakia
Binghamton University, Binghamton, NY
Paper No:
IPACK2017-74174, V001T02A008; 10 pages
Published Online:
October 27, 2017
Citation
Alkharabsheh, S, Ramakrishnan, B, & Sammakia, B. "Failure Analysis of Direct Liquid Cooling System in Data Centers." Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 29–September 1, 2017. V001T02A008. ASME. https://doi.org/10.1115/IPACK2017-74174
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