This paper provides details of Knowledge Based Qualification (KBQ) methodology to calculate BGA component shock qualification requirements. The methodology is based on experimental, theoretical and computational approach used to generate a detailed knowledge of the use conditions and failure physics. Discussed are the steps taken to understand the end-user behavior and system design impact on dynamic load experienced by the component in the field. A special focus is placed on the understanding of the board deformation modes, their impact on BGA failures, and the physics-of-failure (PoF) metric that is not only accurate enough but also practical for everyday applications. Theoretical and computational modeling was used to perform the necessary “translations” from use condition to test conditions and from system level drop to test board component shock. These “translations” enabled by the PoF metric, directly lead to the determination of BGA shock qualification requirements.
Skip Nav Destination
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
PROCEEDINGS PAPER
Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components Available to Purchase
Guru Arakere,
Guru Arakere
Intel Corporation, Chandler, AZ
Search for other works by this author on:
Milena Vujosevic
Milena Vujosevic
Intel Corporation, Santa Clara, CA
Search for other works by this author on:
Min Pei
Intel Corporation, Hillsboro, OR
Guru Arakere
Intel Corporation, Chandler, AZ
Milena Vujosevic
Intel Corporation, Santa Clara, CA
Paper No:
IPACK2017-74082, V001T01A012; 7 pages
Published Online:
October 27, 2017
Citation
Pei, M, Arakere, G, & Vujosevic, M. "Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components." Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 29–September 1, 2017. V001T01A012. ASME. https://doi.org/10.1115/IPACK2017-74082
Download citation file:
18
Views
Related Proceedings Papers
Related Articles
Some Topics in Recent Advances and Applications of Structural Impact Dynamics
Appl. Mech. Rev (May,2011)
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
J. Electron. Packag (September,2005)
Numerical Study of Impact Penetration Shearing Employing Finite Strain Viscoplasticity Model Incorporating Adiabatic Shear Banding
J. Eng. Mater. Technol (January,2009)
Related Chapters
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler & Pressure Vessel Codes, Volume 1 Sixth Edition
Introduction and Definitions
Handbook on Stiffness & Damping in Mechanical Design
Concluding Remarks and Future Work
Ultrasonic Welding of Lithium-Ion Batteries