With recent advancements in additive manufacturing (AM) technology, it is possible to deposit copper conductive paths and insulation layers of an electric machine in a selective controlled manner. AM of copper enables higher fill factors that improves the internal thermal conduction in the stator core of the electric machine (induction motor), which will enhance its efficiency and power density. This will reduce the motor size and weight and make it more suitable for aerospace and electric vehicle applications, while reducing / eliminating the rare-earth dependency. The objective of this paper is to present the challenges associated with AM of copper coils having 1×1mm cross section and complex features that are used in producing ultra-high efficiency induction motor for traction applications. The paper also proposes different approaches that were used by the authors in attempts to overcome those challenges.
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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
August 29–September 1, 2017
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5809-7
PROCEEDINGS PAPER
Challenges in 3D Printing of High Conductivity Copper
Tahany El-Wardany,
Tahany El-Wardany
United Technologies Research Center, East Hartford, CT
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Ying She,
Ying She
United Technologies Research Center, East Hartford, CT
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Vijay Jagdale,
Vijay Jagdale
United Technologies Research Center, East Hartford, CT
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Jacquelynn K. Garofano,
Jacquelynn K. Garofano
United Technologies Research Center, East Hartford, CT
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Joe Liou,
Joe Liou
United Technologies Research Center, East Hartford, CT
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Wayde Schmidt
Wayde Schmidt
United Technologies Research Center, East Hartford, CT
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Tahany El-Wardany
United Technologies Research Center, East Hartford, CT
Ying She
United Technologies Research Center, East Hartford, CT
Vijay Jagdale
United Technologies Research Center, East Hartford, CT
Jacquelynn K. Garofano
United Technologies Research Center, East Hartford, CT
Joe Liou
United Technologies Research Center, East Hartford, CT
Wayde Schmidt
United Technologies Research Center, East Hartford, CT
Paper No:
IPACK2017-74306, V001T01A005; 10 pages
Published Online:
October 27, 2017
Citation
El-Wardany, T, She, Y, Jagdale, V, Garofano, JK, Liou, J, & Schmidt, W. "Challenges in 3D Printing of High Conductivity Copper." Proceedings of the ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Francisco, California, USA. August 29–September 1, 2017. V001T01A005. ASME. https://doi.org/10.1115/IPACK2017-74306
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