This paper reports on a microfluidic-based tactile sensor capable of detecting forces along two directions and torque about one direction. The 3-Degree-Of-Freedom (3-DOF) force/torque sensor encompasses a symmetric three-dimensional (3D) microstructure embedded with two sets of electrolyte-enabled distributed resistive transducers underneath. The 3D microstructure is built into a rectangular block with a loading-bump on its top and two microchannels at its bottom. Together with electrode pairs distributed along the microchannel length, electrolyte in each microchannel functions as a set of three resistive transducers. While a normal force results in a resistance increase in the two sets of transducers, a shear force causes opposite resistance changes in the two sets of transducers. Conversely, a torque leads to the opposite resistance changes in the two side transducers in each set. Soft lithography and CNC molding are combined to fabricate a prototype tactile sensor. The experimental results validate the feasibility of using this microfluidic-based tactile sensor for 3-DOF force/torque detection.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5690-1
PROCEEDINGS PAPER
A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection
Yichao Yang,
Yichao Yang
Old Dominion University, Norfolk, VA
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Zhili Hao
Zhili Hao
Old Dominion University, Norfolk, VA
Search for other works by this author on:
Yichao Yang
Old Dominion University, Norfolk, VA
Zhili Hao
Old Dominion University, Norfolk, VA
Paper No:
IPACK2015-48133, V003T07A010; 8 pages
Published Online:
November 19, 2015
Citation
Yang, Y, & Hao, Z. "A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays. San Francisco, California, USA. July 6–9, 2015. V003T07A010. ASME. https://doi.org/10.1115/IPACK2015-48133
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