Cutting edge tablet and phone designs are increasingly utilizing OLED (Organic Light Emitting Diode) displays. Although these displays are very thin and have excellent picture quality, they come at the cost of higher power than traditional displays which presents new thermal challenges. For thermal purposes, there are essentially 2 basic types of OLED displays based on their power distribution. In this presentation, I show thermal modeling methods I developed for both types of OLED displays and show the successful correlation of these models to experimental results. In addition, this presentation discusses some of the unique structural design requirements with OLED displays and ways to integrate both the thermal and structural solutions into an elegant combined solution. A thermal engineer can use the simulation methods and design recommendations described in this presentation to enable integration of this technology into products at an early stage of the design process.
Skip Nav Destination
Close
Sign In or Register for Account
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5690-1
PROCEEDINGS PAPER
Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations
Carin Lundquist Ruiz
Carin Lundquist Ruiz
Intel Corporation, Santa Clara, CA
Search for other works by this author on:
Carin Lundquist Ruiz
Intel Corporation, Santa Clara, CA
Paper No:
IPACK2015-48769, V003T04A022; 4 pages
Published Online:
November 19, 2015
Citation
Ruiz, CL. "Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays. San Francisco, California, USA. July 6–9, 2015. V003T04A022. ASME. https://doi.org/10.1115/IPACK2015-48769
Download citation file:
- Ris (Zotero)
- Reference Manager
- EasyBib
- Bookends
- Mendeley
- Papers
- EndNote
- RefWorks
- BibTex
- ProCite
- Medlars
Close
Sign In
12
Views
0
Citations
Related Proceedings Papers
Related Articles
Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by Quantum Dots at Silica-on-Chip Structure
J. Electron. Packag (September,2019)
Special Section on InterPACK 2013
J. Electron. Packag (December,2014)
Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging
J. Electron. Packag (December,2019)
Related Chapters
Multi-Channel Constant Current LED Driver with PWM Boost Converter
International Conference on Mechanical Engineering and Technology (ICMET-London 2011)
Modeling and Simulation of Cutting Temperature Field with Serrated Chip
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
Developing Human Performance Measures (PSAM-0207)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)