As demands on performance for mobile electronics continue to increase, traditional packaging technology is facing its limit in number of input/outputs (I/Os) and thermal challenges. Glass interposers offer many advantages over previous packaging technology for mobile electronics, including ultra-high electrical resistivity, low loss, and lower cost at processed interposer levels. However, it has two fundamental limitations; brittleness and relatively low thermal conductivity (∼1 W/mK), compared to Si (∼150 W/mK). This paper presents a study on thermal performance enhancement of glass interposer based on thermal modeling, and compares it with silicon interposer. The model captures in-plane and out-of-plane thermal performance enhancement with copper structures incorporated in the interposer. To further study the effect of advanced cooling schemes on interposer technology, an integrated vapor chamber design is evaluated through computational modeling.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5690-1
PROCEEDINGS PAPER
Thermal Performance Enhancement of Glass Interposer
Sangbeom Cho,
Sangbeom Cho
Georgia Institute of Technology, Atlanta, GA
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Yogendra K. Joshi
Yogendra K. Joshi
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Sangbeom Cho
Georgia Institute of Technology, Atlanta, GA
Yogendra K. Joshi
Georgia Institute of Technology, Atlanta, GA
Paper No:
IPACK2015-48563, V003T04A021; 7 pages
Published Online:
November 19, 2015
Citation
Cho, S, & Joshi, YK. "Thermal Performance Enhancement of Glass Interposer." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays. San Francisco, California, USA. July 6–9, 2015. V003T04A021. ASME. https://doi.org/10.1115/IPACK2015-48563
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