This work examines the microscale physics of heat transfer processes in flow boiling of FC-72 in a single microchannel. Experimental results discussed in this paper provide new physical insight on the nature of heat transfer events. The study is enabled through development of a device with a composite substrate that consists of a high thermal conductivity material coated by a thin layer of a low thermal conductivity material with embedded temperature sensors. This novel arrangement enables measurement of local heat flux with a spatial resolution of 40–65 μm and a temporal resolution of 50 μs. The device generates isolated bubbles from a 300 nm in diameter artificial cavity fabricated at the center of a pulsed function micro-heater. Analysis of the temperature and heat flux data along with synchronized images of bubbles show that four mechanisms of heat transfer are active as a bubble grows and flows through the channel. These mechanisms of heat transfer are 1) microlayer evaporation, 2) interline evaporation, 3) transient conduction, and 4) micro-convection. The magnitude and time period of activation of these mechanisms of heat transfer are determined and their characteristics are discussed in details.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5689-5
PROCEEDINGS PAPER
Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels
Sajjad Bigham,
Sajjad Bigham
University of Florida, Gainesville, FL
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Saeed Moghaddam
Saeed Moghaddam
University of Florida, Gainesville, FL
Search for other works by this author on:
Sajjad Bigham
University of Florida, Gainesville, FL
Saeed Moghaddam
University of Florida, Gainesville, FL
Paper No:
IPACK2015-48581, V002T06A017; 12 pages
Published Online:
November 19, 2015
Citation
Bigham, S, & Moghaddam, S. "Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales. San Francisco, California, USA. July 6–9, 2015. V002T06A017. ASME. https://doi.org/10.1115/IPACK2015-48581
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