This paper discusses a new approach for definition of temperature cycling qualification requirement that accounts for the physics of the deformation process in use condition and in the accelerated temperature cycling test condition. The methodology is used to define solder joint reliability (SJR) requirement for Package on Package (PoP) components. Included in the study is the impact of adhesives on SJR requirements. The approach used is different from standards-based approaches that define the requirements in the way that is often independent of package materials and geometries. Physics based damage metrics and numerical modeling was used to comprehend design, technology, material, and temperature profile and provide an in-depth understanding of package deformation and failure mechanism. This, coupled with a developed fatigue law was then used to translate use conditions to test condition requirement.

The study shows that accelerated test will not accelerate all PoP solder joints equally and that requirements for PoP to board interconnects will be different from requirements for top–to–bottom package interconnects. Similarly, for component with adhesives, when requirements are based on physics, they must be different than requirements for component without adhesive and those requirement should be a function of adhesive thermo-mechanical material properties.

Given rapid changes in technology, explosion of new devices and new use conditions, manufacturers constantly make tradeoffs between performance, cost and reliability. The qualification process needs to be optimized to meet these increasing challenges and qualification based on knowledge of physics presented in this paper is designed to meet these challenges.

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