A novel interconnect approach was developed to enable packaging of miniature (<0.5 mm) MEMS pressure sensors for minimally invasive sensing applications. The interconnect approach is a variant of traditional flexible laminate circuits but does not require expensive patterning steps. It provides tight tolerance and assembly automation at relatively lower costs. In this paper, details of the novel interconnect and cabling approaches are disclosed. Examples of applications that benefit from this approach are also discussed. Experimental results on new ultra-miniature sensors utilizing the developed interconnect approach are presented.

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