Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and high humidity conditions. In this work, the material behavior changes occurring in underfill materials subjected to moisture exposures in an humidity chamber have been characterized using 60 × 3 × 0.5 mm uniaxial test specimens which were cured with production equipment using the same conditions as those used in actual flip chip assembly. After curing, the samples were divided into two groups and subjected to different preconditioning: (1) no preconditioning, (2) prebaking at 85 C for 24 hours. The fabricated and preconditioned uniaxial test specimens were then exposed in an adjustable thermal and humidity chamber to combined hygrothermal exposures at 85 C and 85% RH for various durations (0, 1, 3, 10, 30, 60 days). After the moisture exposures, a microscale tension-torsion testing machine was used to evaluate the complete stress-strain behavior of the material at room temperature (25 C). In addition, the viscoelastic mechanical response of the underfill encapsulant has also been characterized via creep testing at room temperature for several applied stress levels after the moisture exposures. From the recorded results, it was found that the moisture exposures strongly degrade the mechanical properties of the tested underfill including the initial elastic modulus, ultimate tensile stress, and tensile creep rate. Prebaking was found to increase the initial material properties, but the degradations due to subsequent moisture exposures occurred in a similar manner.
- Electronic and Photonic Packaging Division
Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning
Chowdhury, PR, Chhanda, NJ, Suhling, JC, & Lall, P. "Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales. San Francisco, California, USA. July 6–9, 2015. V002T01A013. ASME. https://doi.org/10.1115/IPACK2015-48622
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