Design of new antenna mount with low effective projected area (EPA) and high load carrying capacity for telecommunication towers is discussed in this paper. The main aim is to reduce the EPA of the mount against the wind pressure direction at the desired elevation from ground by reducing the mount frame structure parts compared to the previous mount designs used in the market. The model in itself has to withstand its dead weight, operator’s weight along with five antenna-radio units. The new model has been designed with a single horizontal frame and four supporting structure for EPA reduction and also the EPA is calculated through Image Processing using MATLAB tool which has not been done previously for mounting structures in the telecommunication field. The preliminary stress and deformation results calculated using ANSYS 15.0 tool and future work that has to be carried out for the design are also discussed in this paper.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5689-5
PROCEEDINGS PAPER
Design of the Next Generation Antenna Mounts
Ruben Gregory Puthota Dominic Savio
,
Ruben Gregory Puthota Dominic Savio
UTA, Arlington, TX
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Betsegaw Gebrehiwot
,
Betsegaw Gebrehiwot
UTA, Arlington, TX
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Tom Palmer
Tom Palmer
CommScope, Euless, TX
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Ruben Gregory Puthota Dominic Savio
UTA, Arlington, TX
Betsegaw Gebrehiwot
UTA, Arlington, TX
Dereje Agonafer
UTA, Arlington, TX
Al Skrepcinski
CommScope, Euless, TX
Tom Palmer
CommScope, Euless, TX
Paper No:
IPACK2015-48594, V002T01A007; 7 pages
Published Online:
November 19, 2015
Citation
Savio, RGPD, Gebrehiwot, B, Agonafer, D, Skrepcinski, A, & Palmer, T. "Design of the Next Generation Antenna Mounts." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales. San Francisco, California, USA. July 6–9, 2015. V002T01A007. ASME. https://doi.org/10.1115/IPACK2015-48594
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