Augmenting the thermal conductivity of polymer materials is actively being attempted by adding one or more fillers with higher thermal conductivity into matrix materials. In this study, the effective thermal conductivity of composite materials was investigated numerically under the effects of the thermal conductivity ratio between two particle fillers and the matrix material, and the particle volume fractions. The results indicate that the effective thermal conductivity of composites containing hybrid filler is higher than that of single filler. The effective thermal conductivity increases with the increase of thermal conductivity ratio between two fillers in general when this ratio is less than unity, and the maximum effective thermal conductivity approaches when this ratio is less than and close to unity. However, this trend is changed when this ratio is greater than unity. Based on the results, a generalized correlation is proposed as a function of four non-dimensional parameters. The results obtained in this study can be widely utilized for predicting the thermal conductivity of hybrid-filler-nanoparticle composite materials.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5688-8
PROCEEDINGS PAPER
A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials
Ich-Long Ngo,
Ich-Long Ngo
Yeungnam University, Gyeongsan, Korea
Search for other works by this author on:
Chan Byon
Chan Byon
Yeungnam University, Gyeongsan, Korea
Search for other works by this author on:
Ich-Long Ngo
Yeungnam University, Gyeongsan, Korea
Chan Byon
Yeungnam University, Gyeongsan, Korea
Paper No:
IPACK2015-48740, V001T09A089; 6 pages
Published Online:
November 19, 2015
Citation
Ngo, I, & Byon, C. "A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A089. ASME. https://doi.org/10.1115/IPACK2015-48740
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