Challenges and Opportunities in Thermal Management of Multi-Chip Packages

Multi-chip packages (MCPs) based solutions are becoming increasingly adopted as it results in higher signal count, density and enables increasing bandwidth demands and allows for heterogeneous integration [1,2]. However, manufacturing tolerances impose a variability in these stacks which results in new requirements for thermal interface materials. This paper describes the thermal, mechanical, and reliability challenges associated with MCP packages, and highlights need for novel thermal interface materials.