Multi-chip packages (MCPs) based solutions are becoming increasingly adopted as it results in higher signal count, density and enables increasing bandwidth demands and allows for heterogeneous integration [1,2]. However, manufacturing tolerances impose a variability in these stacks which results in new requirements for thermal interface materials. This paper describes the thermal, mechanical, and reliability challenges associated with MCP packages, and highlights need for novel thermal interface materials.
- Electronic and Photonic Packaging Division
Challenges and Opportunities in Thermal Management of Multi-Chip Packages
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Dhavaleswarapu, HK, Jha, CM, Smith, SF, Kothari, S, Bicen, B, Saha, SK, & Gupta, A. "Challenges and Opportunities in Thermal Management of Multi-Chip Packages." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A084. ASME. https://doi.org/10.1115/IPACK2015-48362
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