Within the paper the efficiency of heat transfer through the thermal interface made of three different sintered nanosilver based materials was considered. The efficiency of heat conduction was analyzed by using the IR camera to monitor the changes of junction temperature in the chip of power transistor attached by different TIMs to copper lead-frame. Because in each case the transistor was powered in the same way so the lower difference between junction temperature and substrate temperature meant the better heat transfer efficiency. Moreover by using the X-ray inspection the structural analysis of interface was done.

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