Limited heat dissipation and increasing power consumption in processors has led to a utilization wall. Specifically due to high transistor density, not all processors can be used continuously without exceeding safe operating temperatures. This is more significant in mobile electronic devices which, despite relatively large chip area, are limited by poor heat dissipation — primarily natural convection from the exposed surfaces. In the past, solid-to-liquid phase change materials (PCMs) have been employed for passive thermal control — absorbing energy during the phase change process while maintaining a relatively fixed temperature. However, the lower thermal conductivity of the liquid phase after melting often limits the heat dissipation from the PCM, and in the liquid state, the material can flow away from the desired location. Here we focus on characterization of thermal performance of PCMs with the goal of evaluating dry (gel-to-solid/amorphous-to-crystalline) phase change materials which are intended to mitigate the pumpout issue. Critical thermophysical properties include the thermal conductivity, heat capacity, and latent heat of the phase/state change. The thermal resistance throughout the phase change process is measured by in-house rig which miniaturizes the reference bar method for use with infrared temperature sensing.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5688-8
PROCEEDINGS PAPER
Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances Available to Purchase
Yash Ganatra,
Yash Ganatra
Purdue University, West Lafayette, IN
Search for other works by this author on:
Amy Marconnet
Amy Marconnet
Purdue University, West Lafayette, IN
Search for other works by this author on:
Yash Ganatra
Purdue University, West Lafayette, IN
Amy Marconnet
Purdue University, West Lafayette, IN
Paper No:
IPACK2015-48499, V001T09A064; 7 pages
Published Online:
November 19, 2015
Citation
Ganatra, Y, & Marconnet, A. "Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A064. ASME. https://doi.org/10.1115/IPACK2015-48499
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