A major challenge in the implementation of evaporative two-phase liquid-cooled ICs with embedded fluid microchannels/cavities is the high pressure drops arising from evaporation-induced expansion and acceleration of the flowing two-phase fluid in small hydraulic diameters. Our ongoing research effort addresses this challenge by utilizing a novel hierarchical radially expanding channel networks with a central embedded inlet manifold and drainage at the periphery of the chip stack. This paper presents a qualitative description of the thermal design process that has been adopted for this radial cavity. The thermal design process first involves construction of a system-level pressure-thermal model for the radial cavity based on both fundamental experiments as well as numerical simulations performed on the building block structures of the final architecture. Finally, this system-level pressure-thermal model can be used to identify the design space and optimize the geometry to maximize thermal performance, while respecting design specifications. This design flow presents a good case study for electrical-thermal co-design of two-phase liquid cooled ICs.
- Electronic and Photonic Packaging Division
Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
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Sridhar, A, Ong, CL, Paredes, S, Michel, B, Brunschwiler, T, Parida, P, Colgan, E, Chainer, T, Gorle, C, & Goodson, KE. "Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A039. ASME. https://doi.org/10.1115/IPACK2015-48690
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