A major challenge in the implementation of evaporative two-phase liquid-cooled ICs with embedded fluid microchannels/cavities is the high pressure drops arising from evaporation-induced expansion and acceleration of the flowing two-phase fluid in small hydraulic diameters. Our ongoing research effort addresses this challenge by utilizing a novel hierarchical radially expanding channel networks with a central embedded inlet manifold and drainage at the periphery of the chip stack. This paper presents a qualitative description of the thermal design process that has been adopted for this radial cavity. The thermal design process first involves construction of a system-level pressure-thermal model for the radial cavity based on both fundamental experiments as well as numerical simulations performed on the building block structures of the final architecture. Finally, this system-level pressure-thermal model can be used to identify the design space and optimize the geometry to maximize thermal performance, while respecting design specifications. This design flow presents a good case study for electrical-thermal co-design of two-phase liquid cooled ICs.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5688-8
PROCEEDINGS PAPER
Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits Available to Purchase
Arvind Sridhar,
Arvind Sridhar
IBM Research Zürich, Rüschlikon, Switzerland
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Chin Lee Ong,
Chin Lee Ong
IBM Research Zürich, Rüschlikon, Switzerland
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Stefan Paredes,
Stefan Paredes
IBM Research Zürich, Rüschlikon, Switzerland
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Bruno Michel,
Bruno Michel
IBM Research Zürich, Rüschlikon, Switzerland
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Thomas Brunschwiler,
Thomas Brunschwiler
IBM Research Zürich, Rüschlikon, Switzerland
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Pritish Parida,
Pritish Parida
IBM T J Watson Research Center, Yorktown Heights, NY
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Evan Colgan,
Evan Colgan
IBM T J Watson Research Center, Yorktown Heights, NY
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Timothy Chainer,
Timothy Chainer
IBM T J Watson Research Center, Yorktown Heights, NY
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Catherine Gorle,
Catherine Gorle
Stanford University, Stanford, CA
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Kenneth E. Goodson
Kenneth E. Goodson
Stanford University, Stanford, CA
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Arvind Sridhar
IBM Research Zürich, Rüschlikon, Switzerland
Chin Lee Ong
IBM Research Zürich, Rüschlikon, Switzerland
Stefan Paredes
IBM Research Zürich, Rüschlikon, Switzerland
Bruno Michel
IBM Research Zürich, Rüschlikon, Switzerland
Thomas Brunschwiler
IBM Research Zürich, Rüschlikon, Switzerland
Pritish Parida
IBM T J Watson Research Center, Yorktown Heights, NY
Evan Colgan
IBM T J Watson Research Center, Yorktown Heights, NY
Timothy Chainer
IBM T J Watson Research Center, Yorktown Heights, NY
Catherine Gorle
Stanford University, Stanford, CA
Kenneth E. Goodson
Stanford University, Stanford, CA
Paper No:
IPACK2015-48690, V001T09A039; 10 pages
Published Online:
November 19, 2015
Citation
Sridhar, A, Ong, CL, Paredes, S, Michel, B, Brunschwiler, T, Parida, P, Colgan, E, Chainer, T, Gorle, C, & Goodson, KE. "Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A039. ASME. https://doi.org/10.1115/IPACK2015-48690
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