The thermal performance of heat sinks is commonly measured using heat sources with spring loaded thermocouples contained within plastic poppets that press against the heat sink to measure its surface temperature where the heat is applied. However, when the thickness of the heat sink base is small or the effective heat transfer coefficient on the fin side is large, the temperature at the thermocouple contact point is less than the nearby temperature where the heat source contacts the heat sink. This temperature depression under the contact thermocouples has been studied. The heat conduction equation is solved analytically to determine the temperature distribution around the contact thermocouple using a one-dimensional approximation and also a detailed two-dimensional approach. Two dimensionless groups are identified that characterize the detailed two-dimensional solution. The combination of the two dimensionless groups also appears in the one dimensional solution. The temperature distributions are validated using finite difference numerical solutions. It is shown that the one dimensional solution is the limit of the detailed solution when one of the dimensionless groups tends to infinity. A simple equation is provided to estimate the temperature measurement error on the heat sink surface.
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ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5688-8
PROCEEDINGS PAPER
Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples
Kayvan Abbasi,
Kayvan Abbasi
Aavid Thermalloy, Laconia, NH
Search for other works by this author on:
Sukhvinder Kang
Sukhvinder Kang
Aavid Thermalloy, Laconia, NH
Search for other works by this author on:
Kayvan Abbasi
Aavid Thermalloy, Laconia, NH
Sukhvinder Kang
Aavid Thermalloy, Laconia, NH
Paper No:
IPACK2015-48641, V001T09A006; 9 pages
Published Online:
November 19, 2015
Citation
Abbasi, K, & Kang, S. "Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A006. ASME. https://doi.org/10.1115/IPACK2015-48641
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