Thermal management of high power data centers poses challenges due to the high operational cost which is made worse due to the many inefficiencies that arise in them. Additional challenges arise due to the dynamic behaviors that occur during normal operation, and also during emergencies such as power outages or failure of some or all of the cooling equipment. Water and hybrid air plus water cooled data centers are an alternate cooling solution combining liquid cooling systems, such as rear door heat exchangers located within the racks themselves, in addition to the traditional raised floor cold aisle air cooling system. Such a solution may be used when some of the equipment in a data center is upgraded to higher end and higher power equipment which may not be manageable with the existing air cooling system. For a data center with a hybrid cooling system, the cold air supply and the cold water supply should increase in case of an emergency, such as a CRAC (Computer Room Air Conditioner) units’ failure. In this paper, a detailed computational study is conducted to investigate the dynamic response of the impact of a CRAC failure on both water side and air side in a representative hybrid cooling room. The room studied is an air cooled data center using the common cold aisle approach, with rear door heat exchangers installed on all of the racks. CRAC failure is investigated in a hybrid cooling room. The variation and fluctuation in an average rack inlet temperature, and inlet temperatures at different detail locations are presented in plots, showing the dynamic performance of a hybrid cooling data center subjected to the different CRAC failure scenarios. Different response time studies are also presented in this paper.
- Electronic and Photonic Packaging Division
Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units
Gao, T, Samadiani, E, Schmidt, R, & Sammakia, B. "Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T09A015. ASME. https://doi.org/10.1115/IPACK2013-73196
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