This paper describes thermal properties of power Si MOSFET. The problem of hot spot in sub-micron scale Si MOSFET has been widely known. Recently, power Si MOSFET is a key device in a lot of area, for example car electronics. In power Si MOSFET, high voltage is applied and high current is generated. Therefore, heat generation becomes higher and thermal management is important. In this paper, thermal properties of power Si MOSFET is evaluated with Electro-Thermal Analysis and impurity dependency of temperature of power Si MOSFET is discussed. Under high electric field, electron thermal energy becomes much higher than thermal energy of crystal lattice. Therefore, in this paper, non-equilibrium energy state between electron and lattice is considered. Calculated results showed that hot spot appears in power Si MOSFET. Further, it is investigated that the impact of donor density on hot spot temperature is strong.
Skip Nav Destination
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
PROCEEDINGS PAPER
Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis
Risako Kibushi,
Risako Kibushi
Toyama Prefectural University, Imizu, Toyama, Japan
Search for other works by this author on:
Tomoyuki Hatakeyama,
Tomoyuki Hatakeyama
Toyama Prefectural University, Imizu, Toyama, Japan
Search for other works by this author on:
Masaru Ishizuka
Masaru Ishizuka
Toyama Prefectural University, Imizu, Toyama, Japan
Search for other works by this author on:
Risako Kibushi
Toyama Prefectural University, Imizu, Toyama, Japan
Tomoyuki Hatakeyama
Toyama Prefectural University, Imizu, Toyama, Japan
Masaru Ishizuka
Toyama Prefectural University, Imizu, Toyama, Japan
Paper No:
IPACK2013-73273, V002T08A049; 6 pages
Published Online:
January 20, 2014
Citation
Kibushi, R, Hatakeyama, T, & Ishizuka, M. "Estimation of Heat Generation From Power Si MOSFET Using Electro-Thermal Analysis." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T08A049. ASME. https://doi.org/10.1115/IPACK2013-73273
Download citation file:
11
Views
Related Proceedings Papers
Related Articles
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)
J. Heat Transfer (October,2021)
Heat Generation and Transport in Submicron Semiconductor Devices
J. Heat Transfer (February,1995)
Related Chapters
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
An Energy Efficient Hybrid Code Combining Technique for Cluster-Based Cooperative Wireless Networks
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)
Experimental Investigation of an Improved Thermal Response Test Equipment for Ground Source Heat Pump Systems
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)