Branching microchannel networks have been considered as an effective liquid cooling system for electronic components. In this paper, an asymmetric angled branching design of microchannel network is introduced and compared with the parallel branching cooling system. Full CFD models based on finite-element analysis are established to analyze their thermal performances under uniform heat distribution. Performances of angled branching network and a series of parallel networks are compared for a pressure range from 0.5psi to 4psi. Results indicate that the angled branching network dissipates heat better at lower provided pressure drop due to its small flow resistance and flexibility in fluid transportation. On the other hand, a lower peak temperature is noted for the parallel branching network at higher pressure head.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
PROCEEDINGS PAPER
Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink
Cheng Chen,
Cheng Chen
Binghamton University, Binghamton, NY
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Emad Samadiani,
Emad Samadiani
Binghamton University, Binghamton, NY
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Bahgat Sammakia
Bahgat Sammakia
Binghamton University, Binghamton, NY
Search for other works by this author on:
Cheng Chen
Binghamton University, Binghamton, NY
Emad Samadiani
Binghamton University, Binghamton, NY
Bahgat Sammakia
Binghamton University, Binghamton, NY
Paper No:
IPACK2013-73141, V002T08A031; 10 pages
Published Online:
January 20, 2014
Citation
Chen, C, Samadiani, E, & Sammakia, B. "Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T08A031. ASME. https://doi.org/10.1115/IPACK2013-73141
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