In recent years, increasing demands for high performance electronic devices give rise to a necessity to remove enormous amount of heat fluxes from small areas. Uniform temperature distribution and sufficient heat transfer dissipation are crucial issues for proper operation of electronic components. To cope up with thermal management of high heat dissipation devices, an efficient cooling method is required. Jet impingement cooling is one of those promising candidates which can handle heat dissipation in an effective way due to its superior heat transfer rates. In this paper, Al2O3 nanofluid heat transfer characteristics are investigated experimentally. Particle diameter of 31nm Al2O3 is taken into consideration in experiments. Impingement surface (surface area:780mm2) were made from oxygen-free copper to simulate high heat flux dissipating electronic component.
The experimental results show that the suspended nanoparticles remarkably increase the convective heat transfer coefficient of the base fluid.. Nanofluids with particle volume fractions up to 4% can provide significant heat transfer enhancement, on the other hand, it has been found that high volume fractions (higher then 6%), is not appropriate for heat transfer enhancement under the free jet array configuration. Within the range of parameters considered in this study, experimental results indicated that maximum heat transfer coefficient can be obtained for the intermediate jet to heated target distance (around five times of jet diameter) and closely spaced jets (S/D = 3) for the particle volume fraction 2%. Closely spaced jets are particularly suitable for the electronics cooling applications with regards to provide temperature uniformity on the heated surface.