Numerical analyses have been performed to investigate the thermal and hydraulic performances of a double-side micro-jet cooling system for thermal management of a high power Light Emitting Diodes (LEDs) array. Three-dimensional Reynolds-averaged Navier-Stokes (RANS) equations for the steady incompressible laminar flow and conjugate heat transfer were analyzed through a finite volume solver. A parametric study on the double-side micro-jet configuration has been performed to find the effects of seven geometric variables, i.e., diameter of the jet hole, length of the upper jet hole, length of the lower jet holes, distance from the upper jet exit to substrate, distance from the lower jet exit to substrate, height of the upper plenum, and height of the lower plenum, on the lowest temperature level at the chips and the pressure drop. Consequently, it is concluded that among the design variables, diameter of the micro-jet hole, height of the upper plenum, and height of the lower plenum show relatively large impact on the maximum temperature. The diameter of the micro-jet hole shows the largest impact on the maximum temperature, and height of the upper plenum shows the second highest. The height of the upper plenum shows the largest impact on the pressure drop, and other design variables are all of a sort.
Skip Nav Destination
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
PROCEEDINGS PAPER
Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System
Sun-min Kim,
Sun-min Kim
Inha University, Incheon, Republic of Korea
Search for other works by this author on:
Kwang-Yong Kim
Kwang-Yong Kim
Inha University, Incheon, Republic of Korea
Search for other works by this author on:
Sun-min Kim
Inha University, Incheon, Republic of Korea
Kwang-Yong Kim
Inha University, Incheon, Republic of Korea
Paper No:
IPACK2013-73064, V002T08A014; 5 pages
Published Online:
January 20, 2014
Citation
Kim, S, & Kim, K. "Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T08A014. ASME. https://doi.org/10.1115/IPACK2013-73064
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Laminar Heat Transfer in Constructal Microchannel Networks With Loops
J. Electron. Packag (September,2006)
Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
J. Electron. Packag (March,2014)
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
J. Electron. Packag (June,2022)
Related Chapters
Summary
Heat Transfer & Hydraulic Resistance at Supercritical Pressures in Power Engineering Applications
Introduction
Thermal Management of Microelectronic Equipment
The Design and Implement of Remote Inclinometer for Power Towers Based on MXA2500G/GSM
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3