Numerical analyses have been performed to investigate the thermal and hydraulic performances of a double-side micro-jet cooling system for thermal management of a high power Light Emitting Diodes (LEDs) array. Three-dimensional Reynolds-averaged Navier-Stokes (RANS) equations for the steady incompressible laminar flow and conjugate heat transfer were analyzed through a finite volume solver. A parametric study on the double-side micro-jet configuration has been performed to find the effects of seven geometric variables, i.e., diameter of the jet hole, length of the upper jet hole, length of the lower jet holes, distance from the upper jet exit to substrate, distance from the lower jet exit to substrate, height of the upper plenum, and height of the lower plenum, on the lowest temperature level at the chips and the pressure drop. Consequently, it is concluded that among the design variables, diameter of the micro-jet hole, height of the upper plenum, and height of the lower plenum show relatively large impact on the maximum temperature. The diameter of the micro-jet hole shows the largest impact on the maximum temperature, and height of the upper plenum shows the second highest. The height of the upper plenum shows the largest impact on the pressure drop, and other design variables are all of a sort.

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