A numerical model of the thermoreflectance of doped SiC substrate and typical numerical results are presented. The model considers the temporal response of the electron temperature and the number density of the electronic carriers. Calculated results show steep increase of electron temperature and the resulting increase of reflectivity. As a result, the reflected laser pulse by the substrate is compressed in time domain by means of the temporal response of the thermoreflectance characteristics of SiC substrate. Thermal analysis of the electrons reveals the interesting feature of the thermoreflectance response as a function of pulse intensity, pulse width, or doping concentration. The technique can be used for the compression of ultrashort pulse laser light.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5576-8
PROCEEDINGS PAPER
Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate
Hong Duc Doan,
Hong Duc Doan
Tokyo Institute of Technology, Tokyo, Japan
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Kazuyoshi Fushinobu
Kazuyoshi Fushinobu
Tokyo Institute of Technology, Tokyo, Japan
Search for other works by this author on:
Hong Duc Doan
Tokyo Institute of Technology, Tokyo, Japan
Kazuyoshi Fushinobu
Tokyo Institute of Technology, Tokyo, Japan
Paper No:
IPACK2013-73050, V002T08A007; 6 pages
Published Online:
January 20, 2014
Citation
Doan, HD, & Fushinobu, K. "Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. Burlingame, California, USA. July 16–18, 2013. V002T08A007. ASME. https://doi.org/10.1115/IPACK2013-73050
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