The spatially varying magnetic field within a power electronics package contains information of the semiconductor junction temperature and the interconnect currents, temperature, displacement, and strain. The design of semiconductor interconnects for point field detector based high bandwidth current and strain sensing is investigated using finite element analysis (FEA) and verified by experimental results. High bandwidth (10MHz) current sensing was achieved by interconnect design based field shaping and concentration. A displacement sensing resolution of 0.6 μm was achieved by eddy current based high frequency field shaping. Design methodologies to achieve this multifunctional integration of sensing are the primary new contribution of this work.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
PROCEEDINGS PAPER
Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing
J. D. Hoffman,
J. D. Hoffman
UW Madison, WEMPEC, Madison, WI
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R. D. Lorenz
R. D. Lorenz
UW Madison, WEMPEC, Madison, WI
Search for other works by this author on:
J. D. Hoffman
UW Madison, WEMPEC, Madison, WI
B. A. Dow
UW Madison, WEMPEC, Madison, WI
R. D. Lorenz
UW Madison, WEMPEC, Madison, WI
Paper No:
IPACK2013-73269, V001T05A015; 8 pages
Published Online:
January 20, 2014
Citation
Hoffman, JD, Dow, BA, & Lorenz, RD. "Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes. Burlingame, California, USA. July 16–18, 2013. V001T05A015. ASME. https://doi.org/10.1115/IPACK2013-73269
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