This paper presents the characterization of the crack growth rate of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) solder joints under drop impact. Several actual ChipArray® BGA (CTBGA) packages were cross-sectioned, polished and used as the test vehicles. The ball drop tests were performed using a specially-designed tester. The drop impact from the drop ball induces bending in the PCB, which damages the solder joints. The crack lengths in the solder joints were measured after every five drops using microscope imaging. Crack growth rates were calculated from the test results. Insight into the crack growth rate in solder joints under drop impact is provided. The direct cyclic approach for low-cycle fatigue analysis in ABAQUS was used to simulate the crack growth in the solder joints.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
PROCEEDINGS PAPER
Characterization of Crack Growth in BGA Under Drop Impact
Quang Nguyen,
Quang Nguyen
Binghamton University, Binghamton, NY
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Seungbae Park,
Seungbae Park
Binghamton University, Binghamton, NY
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Tung Nguyen
Tung Nguyen
Microsoft Inc., Mountain View, CA
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Quang Nguyen
Binghamton University, Binghamton, NY
Seungbae Park
Binghamton University, Binghamton, NY
Tung Nguyen
Microsoft Inc., Mountain View, CA
Paper No:
IPACK2013-73110, V001T05A002; 6 pages
Published Online:
January 20, 2014
Citation
Nguyen, Q, Park, S, & Nguyen, T. "Characterization of Crack Growth in BGA Under Drop Impact." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes. Burlingame, California, USA. July 16–18, 2013. V001T05A002. ASME. https://doi.org/10.1115/IPACK2013-73110
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