Multilayer ceramic capacitors (MLCCs) are used very widely as electric devices on printed circuit boards (PCBs). Impact loads are applied on MLCCs during PCB manufacturing processes with fast mounting machines or floor dropping of mobile appliances and MLCCs may crack sometime due to the mechanical design. In this paper, impact stresses, which were induced in MLCCs by split Hopkinson bar impact tests, were analyzed with large scale parallel computing method.
Volume Subject Area:
Modeling and Simulation
This content is only available via PDF.
Copyright © 2013 by ASME
You do not currently have access to this content.