The transient and steady-state response of single pass constant-flow (concentric parallel flow, concentric counter flow) heat exchangers was investigated using a finite volume method. Heat exchanger transients initiated by both step-change and sinusoidally varying hot stream inlet temperatures were investigated. The wall separating the fluid streams was modeled by conduction with thermal mass; hence the heat exchanger transient behavior is dependent on the thermal mass of the fluid streams as well as the internal wall. The outer wall is approximated as fully insulating. The time dependent temperature profiles were investigated as a function of heat exchanger dimensionless length and dimensionless time for both fluids. It was found that the transient response of the heat exchanger is controlled by a combination of the residence time and thermal capacitance of the fluid streams, the overall heat transfer coefficient between the fluid streams, and the thermal capacitance of the internal wall.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
PROCEEDINGS PAPER
A Transient Model for Parallel Flow and Counter Flow Heat Exchangers
M. Del Valle,
M. Del Valle
Villanova University, Villanova, PA
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A. P. Wemhoff,
A. P. Wemhoff
Villanova University, Villanova, PA
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A. Ortega
A. Ortega
Villanova University, Villanova, PA
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K. Abbasi
Villanova University, Villanova, PA
M. Del Valle
Villanova University, Villanova, PA
A. P. Wemhoff
Villanova University, Villanova, PA
A. Ortega
Villanova University, Villanova, PA
Paper No:
IPACK2013-73118, V001T04A008; 10 pages
Published Online:
January 20, 2014
Citation
Abbasi, K, Del Valle, M, Wemhoff, AP, & Ortega, A. "A Transient Model for Parallel Flow and Counter Flow Heat Exchangers." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes. Burlingame, California, USA. July 16–18, 2013. V001T04A008. ASME. https://doi.org/10.1115/IPACK2013-73118
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