Glass is widely used as cover glass to protect the smartphones, tablets, PCs, and TVs from everyday wear and tear nowadays. There has been an increasing effort to understand the global behavior of glass substrate under impact, but the behavior of the edge for the thin glass has rarely been touched. In this study, the dynamic response of the glass edge when impacted with 1.75-inch steel ball from different heights (different potential energy) and different angles is studied. High-speed camera is applied for the direct visualization of the whole impact process. The Digital Image Correlation (DIC) method enables to obtain displacements (in-plane displacement and out-of-plane displacement) of the glass during the impact process. The failure mode for the edge impact is found to be predominantly buckling. The tape used in this study decreases wave propagation from the impact location. In addition, the FEA model of edge impact test is developed in ANSYS/LS-DYNA™.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
PROCEEDINGS PAPER
An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact
Liang Xue,
Liang Xue
Binghamton University, Binghamton, NY
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Dapeng Liu,
Dapeng Liu
Binghamton University, Binghamton, NY
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Hohyung Lee,
Hohyung Lee
Binghamton University, Binghamton, NY
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Satish Chaparala,
Satish Chaparala
Corning, Incorporated, Corning, NY
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Seungbae Park
Seungbae Park
Binghamton University, Binghamton, NY
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Liang Xue
Binghamton University, Binghamton, NY
Dapeng Liu
Binghamton University, Binghamton, NY
Hohyung Lee
Binghamton University, Binghamton, NY
Da Yu
Binghamton University, Binghamton, NY
Satish Chaparala
Corning, Incorporated, Corning, NY
Seungbae Park
Binghamton University, Binghamton, NY
Paper No:
IPACK2013-73293, V001T03A008; 8 pages
Published Online:
January 20, 2014
Citation
Xue, L, Liu, D, Lee, H, Yu, D, Chaparala, S, & Park, S. "An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes. Burlingame, California, USA. July 16–18, 2013. V001T03A008. ASME. https://doi.org/10.1115/IPACK2013-73293
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