The needs of glass to resist the scratches, drops impact, and bump from everyday use lead to the importance of investigation of the glass fracture under dynamic impact loading. The strength of the glass under dynamic fracture conditions is significantly larger than that under quasi-static loading. There are several theoretic models. In this study, an accumulated damage model is implemented. The relation among the stress, loading rate, contact time and the fracture is investigated. The effect of impact area, impact energy and impact momentum on the glass fracture has been proved to further improve the dynamic fracture criterion of glass. For the experimental studies, the Digital Image Correlation (DIC) method enables one to obtain the first principal strain of the glass during the impact process. Moreover, the FEA model is developed in ANSYS/LS-DYNA™.
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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 16–18, 2013
Burlingame, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-5575-1
PROCEEDINGS PAPER
An Experimental and Numerical Study of the Dynamic Fracture of Glass
Liang Xue,
Liang Xue
Binghamton University, Binghamton, NY
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Yuling Niu,
Yuling Niu
Binghamton University, Binghamton, NY
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Hohyung Lee,
Hohyung Lee
Binghamton University, Binghamton, NY
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Satish Chaparala,
Satish Chaparala
Corning Incorporated, Corning, NY
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Seungbae Park
Seungbae Park
Binghamton University, Binghamton, NY
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Liang Xue
Binghamton University, Binghamton, NY
Yuling Niu
Binghamton University, Binghamton, NY
Hohyung Lee
Binghamton University, Binghamton, NY
Da Yu
Binghamton University, Binghamton, NY
Satish Chaparala
Corning Incorporated, Corning, NY
Seungbae Park
Binghamton University, Binghamton, NY
Paper No:
IPACK2013-73292, V001T03A007; 9 pages
Published Online:
January 20, 2014
Citation
Xue, L, Niu, Y, Lee, H, Yu, D, Chaparala, S, & Park, S. "An Experimental and Numerical Study of the Dynamic Fracture of Glass." Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes. Burlingame, California, USA. July 16–18, 2013. V001T03A007. ASME. https://doi.org/10.1115/IPACK2013-73292
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