Humidity control in buildings is important for several reasons ranging from ensuring comfort of the occupants to mold control. While the optimum humidity range can be different depending on the function of a particular facility, data centers require especially tight control of humidity and dew point. For example, at low humidity (electro-static discharge) ESD might impose a significant risk to the computing equipment while at high humidity levels hardware failures are more probable due to the growth of conductive filaments or corrosion of circuit boards. In this paper we present a detailed comparison of data centers from several geographical locations, where we have measured humidity and temperature distributions over extended periods of time. The data are analyzed in terms of spatial and temporal dew point variations. We derive detailed dew point “maps” of the respective data center and the impact on reliability and energy efficiency is being discussed.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4462-5
PROCEEDINGS PAPER
Humidity Control and Dew Point Management
Levente J. Klein,
Levente J. Klein
IBM TJ Watson Research Center, Yorktown Heights, NY
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Hendrik F. Hamann
Hendrik F. Hamann
IBM TJ Watson Research Center, Yorktown Heights, NY
Search for other works by this author on:
Levente J. Klein
IBM TJ Watson Research Center, Yorktown Heights, NY
Hendrik F. Hamann
IBM TJ Watson Research Center, Yorktown Heights, NY
Paper No:
IPACK2011-52211, pp. 629-635; 7 pages
Published Online:
February 14, 2012
Citation
Klein, LJ, & Hamann, HF. "Humidity Control and Dew Point Management." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 629-635. ASME. https://doi.org/10.1115/IPACK2011-52211
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