Potential-flow-based airflow and heat transfer models have been proposed as a computationally efficient alternative to the Navier-Stokes Equations for predicting the three-dimensional flow field in data center applications. These models are simple, solve quickly, and capture much of the fluid flow physics, but ignore buoyancy and frictional effects, i.e., rotationality, turbulence, and wall friction. However, a comprehensive comparison of the efficiency and accuracy of these methods versus more sophisticated tools, like CFD, is lacking. The main contribution of this paper is a study of the performance of potential-flow methods compared to CFD in eight layouts inspired by actual data center configurations. We demonstrate that potential-flow methods can be helpful in data center design and management applications.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4462-5
PROCEEDINGS PAPER
Potential-Flow Modeling for Data Center Applications
Christopher M. Healey,
Christopher M. Healey
APC by Schneider Electric, Billerica, MA
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James W. VanGilder,
James W. VanGilder
APC by Schneider Electric, Billerica, MA
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Zachary R. Sheffer,
Zachary R. Sheffer
Northeastern University, Boston, MA
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Xuanhang Simon Zhang
Xuanhang Simon Zhang
APC by Schneider Electric, Billerica, MA
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Christopher M. Healey
APC by Schneider Electric, Billerica, MA
James W. VanGilder
APC by Schneider Electric, Billerica, MA
Zachary R. Sheffer
Northeastern University, Boston, MA
Xuanhang Simon Zhang
APC by Schneider Electric, Billerica, MA
Paper No:
IPACK2011-52136, pp. 527-534; 8 pages
Published Online:
February 14, 2012
Citation
Healey, CM, VanGilder, JW, Sheffer, ZR, & Zhang, XS. "Potential-Flow Modeling for Data Center Applications." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 527-534. ASME. https://doi.org/10.1115/IPACK2011-52136
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