Airside economizers in data centers introducing outside air directly in cold aisles or at CRAC level have been considered recently to reduce overall energy to cool IT equipment. However, such designs limit the operational envelope of free cooling based on the required supply air temperature to the IT equipment. More studies are required to optimize airside economizer layouts to increase the operation time and hence, increase the energy savings. This paper presents a case study of different outside air delivery configurations including outside air introduced in cold aisles, in plenum close to CRAC units’ supply side, at return side of CRAC units and in hot aisles. The temperature and flow fields are studied numerically and are compared to each other. Mixing of the cooler outside air with the hot air is studied to determine optimal local distribution of the outside air in a non-homogeneous data center to maximize natural cooling. The paper also quantifies the annual average performance of the outside air infrastructure to include the effects of the seasonal variations in the ambient temperature.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4462-5
PROCEEDINGS PAPER
Optimization of Outside Air Cooling in Data Centers
Niru Kumari,
Niru Kumari
Hewlett-Packard Laboratories, Palo Alto, CA
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Rocky Shih,
Rocky Shih
Hewlett-Packard Laboratories, Palo Alto, CA
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Alan McReynolds,
Alan McReynolds
Hewlett-Packard Laboratories, Palo Alto, CA
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Ratnesh Sharma,
Ratnesh Sharma
Hewlett-Packard Laboratories, Palo Alto, CA
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Tom Christian,
Tom Christian
Hewlett-Packard Laboratories, Palo Alto, CA
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Cullen Bash
Cullen Bash
Hewlett-Packard Laboratories, Palo Alto, CA
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Niru Kumari
Hewlett-Packard Laboratories, Palo Alto, CA
Rocky Shih
Hewlett-Packard Laboratories, Palo Alto, CA
Alan McReynolds
Hewlett-Packard Laboratories, Palo Alto, CA
Ratnesh Sharma
Hewlett-Packard Laboratories, Palo Alto, CA
Tom Christian
Hewlett-Packard Laboratories, Palo Alto, CA
Cullen Bash
Hewlett-Packard Laboratories, Palo Alto, CA
Paper No:
IPACK2011-52132, pp. 519-525; 7 pages
Published Online:
February 14, 2012
Citation
Kumari, N, Shih, R, McReynolds, A, Sharma, R, Christian, T, & Bash, C. "Optimization of Outside Air Cooling in Data Centers." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 519-525. ASME. https://doi.org/10.1115/IPACK2011-52132
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